Description
This premium resin polishing pad is developed for controlled surface levelling after the initial heavy cutting stage. Its wide rectangular design allows consistent contact with the stone surface, ensuring even material removal and reducing the chances of uneven patches or deep swirl marks.
Manufactured using a high-strength resin bond, the pad delivers steady cutting performance while maintaining structural stability during prolonged use. The reinforced backing minimizes vibration and improves handling, allowing smoother operation across flat and semi-flat stone areas.







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